Our power module epoxy molding compounds achieve good reliability in terms of low CTE, low modulus and high Tg, and are able to reduce stress caused by temperature fluctuations.
In addition, they are ideally suited to organic substrate packages.
|CTE α1 (ppm/K)||9||10||14|
|CTE α2 (ppm/K)||44||44||51|
|Mold Shrinkage (%)||0.08||0.14||0.12|
|PCT24h Water Absorption (%)||0.35||0.39||0.55|
|150°C Volume Resistivity (Ωcm)||5×1012||5×1012||5×1012|