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High Thermal Conductivity Epoxy Molding Compounds

Our high thermal conductivity epoxy molding compounds are low stress with excellent moldability and reliability.

The rapid curing characteristics of this grade are suitable for auto mold machines.

The KE-870 Series can achieve thermal conductivity of 3.4W/mK by using our high thermal conductivity filler technology.

850SP
Our high thermal conductivity epoxy molding compounds can mold with zero void for packages with different gap clearances on the top and bottom of the frame.

Evaluated Package: TO-220
Bottom Gap Clearance: 0.3mm

Recommended Package Type

Isolated packages (TO-220, TO-3P, etc.) that require high thermal dispersion.
Large power module packages that require very high heat dispersion.

Main Characteristics

CharacteristicUnitKE-850SHKE-850SKE-850SPKE-870
Spiral Flow cm 35 55 50 50
Gelation Time s 25 42 35 35
Specific Gravity 2.2 2.2 2.2 2.4
CTE α1 ppm/K 22 21 21 15
CTE α2 59 55 59 66
Tg °C 175 175 190 160
Thermal Conductivity W/mK 2.3 2.3 2.3 3.4

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