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KE-G1250 Series Low-Warpage EMC

The KE-G1250 Series has excellent properties of low warpage for organic substrate packages.
Beyond good warpage performance in BGA packages, it is also suitable for fine pitch Au / Cu / Ag wires.
Furthermore, it can also be used for SMD applications. It has a wide range of mold shrinkages, CTE's and modulus for better warpage control.

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Features

  • With our unique technology, we meet the low warpage requirements for all areas of array packages
  • Applicable to fine-pitch fine wire, Cu/Ag wire bonding
  • Applicable to batch-forming transfer molding with good moldability and stable yield performance
GradeKE-G1250
TC-S3W
KE-G1250
TC-S3
KE-G1250
TC-S3U
Spiral Flow (cm) [70kgf] 160 190 195
Gelation Time (s) 45 45 45
Flow Viscosity (Pa•s) 5 5 5
Specific Gravity (-) 1.99 1.97 1.97
Tg (°C) 145 145 145
CTE α1(ppm/K) 9 10 10
CTE α2(ppm/K) 35 38 40
Flexural Strength @25C° (MPa) 175 175 175
Flexural Modulus @25C° (GPa) 23 23 23
Water Absorption (PCT) (%) 0.38 0.40 0.40
Mold Shrinkage (%) 0.11 0.13 0.18
EC (mS/m) 4.0 4.0 4.0
pH (-) 6.0 6.0 6.0
Na+ (ppm) 2.0 2.0 2.0
Cl-(ppm) 10 10 10
Applicable for Cu Wired Packages yes yes yes

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