With a variety of materials and processing technologies to meet the needs of the market, Kyocera’s semiconductor packages are used for increasingly diverse applications.
Electronic technology is becoming ever more essential in mobile phones, digital consumer appliances, information & communication equipment and automobiles. Based on a variety of package materials and processing technologies, Kyocera offers packages and substrates that meet the requirements of the semiconductors and electronic devices used in these applications.
Major Package Applications
- Mobile phones
- Routers and servers
- Wireless base stations
- Digital cameras and camcorders
- Optical communications devices
- Automotive electronics
Surface Mount Packages for Electronic Devices
Kyocera's ultra-small surface-mount ceramic packages for crystal units, oscillators and surface acoustic wave (SAW) filters help provide advanced functionality and performance in today's ever-smaller mobile phones.
Ceramic packages with open-air cavities and optically coated glass are required for image sensors — key devices used in digital cameras and mobile phones.
Kyocera supports today’s broadband Internet with components for fiber-optic communications networks, such as high-speed laser diode packages and fiber-optic connectors.
New applications for high-power LEDs require better thermal management. The excellent durability and thermal conductivity of Kyocera’s ceramics make them ideal for use in packages and substrates for LEDs.
Kyocera’s large-scale multilayer-ceramic substrates are used in such applications as probe cards for semiconductor testing devices, high-performance medical equipment and supercomputers.
As servers become increasingly sophisticated, Kyocera’s high-density multilayer ceramic packages with low-resistance copper conductors help ensure optimum performance under peak processing loads.
Kyocera’s fine-pitch organic packages employ the latest advances in micro-wiring and multilayer organic technology to support the most advanced digital consumer products.
Package Structure and Technologies (Multilayer Ceramic)
Material Technology
Various materials are available to meet wide-ranging requirements such as high strength, high thermal conductivity and low dielectric loss.
Metallization Technology
Kyocera’s ceramics can be metallized with various conductors, including tungsten, copper and silver, to meet specific electrical needs. Metallization also allows ceramics and metals to be joined by brazing.
Design Technology
Package designs are electrically and thermally optimized to produce the highest possible performance from semiconductors and electronic devices.
Multilayer Ceramic Technology
Ceramics with metallized conductors are laminated to create high-density, three-dimensional circuitry within the package material itself.
Irregular-Shape Processing Technology
Ceramic materials can be formed with cavities to meet specific functional requirements.
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