KYOCERA America, Inc. (U.S.A.), Kagoshima Kokubu Plant (Japan)
Kyocera's cutting-edge semiconductor package products range from substrates with high-density wiring patterns to multilayer packages with built-in embedded components.
Developed from ceramic and organic materials, Kyocera's semiconductor packages, substrates and mounting components play a key role in computers, automotive electronics, telecommunications networks and digital consumer products.
Image Sensor Components
Ceramic packages with open-air cavities and optically coated glasses are required for image sensors - key devices of digital cameras and mobile phones.
Kyocera's ultra-small surface-mount ceramic packages for crystal units and surface-acoustic wave(SAW) filters help provide advanced functionality and performance in today's ever-smaller mobile phones.
Ceramic packages have excellent RF and thermal properties.
So they facilitate the advancement of wireless communication infrastructures such as cellular phone base stations. Also they contribute to practical use of millimeter-wave technology.
Combining the benefits of high-precision processing and optical bonding technologies, Kyocera provides fiber optic components to meet rising demand for broadband communications.
As servers become increasingly sophisticated, Kyocera's high-density multilayer ceramic packages with low-resistance copper conductors help ensure optimum performance under peak processing loads.
Kyocera' s fine-pitch organic packages employ the latest advances in micro-wiring and multilayer organic technology to support the most advanced digital consumer products.
Low Temperature Co-fired Ceramic (LTCC) packages for ultra-small, multifunctional RF modules contribute to the advancement of mobile communication equipments by incorporating the capabilities of traditionally surface-mounted components, such as filters, couplers and baluns.
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