The product manufactured at Kyocera's foundation in 1959 was ceramic parts for television electron gun called 'U-type Kerushima'. Multi-form glass marketed two years later with same application but with different materials is still manufactured today. In 1960, micro module substrate used in communications equipment, computers and other devices were developed. The metallizing process used for micro module substrate became a technology that widened the field of application of ceramics dramatically to electronic parts and industrial machinery parts.
In 1964, transistor beads stem was developed. Fine ceramic part was used in silicon transistors developed in the US and this is where the relationship of ceramics and semiconductors began. Later, as a container to protect integrated circuits (ICs) and to make them function, CerDIP was developed in 1967 followed by multilayer package in 1969. The tape layering technology used here is also applied in the manufacture of laminated ceramic capacitors and ceramic heaters.
In 1972, CERATIP W was developed as a metal cutting tool. This has no attrition in strength and hardness even at high temperatures even when cutting steel and cast iron, is and also capable for high-speed cutting. Today, Cermet, a compound of ceramic and metal developed in 1976, is gradually becoming the mainstream metal cutting tool, since it is resistant to high temperature, hard with toughness peculiar to metal and is not as brittle as ceramic.
In 1964, transistor beads stem was developed. Fine ceramic part was used in silicon transistors developed in the US and this is where the relationship of ceramics and semiconductors began. Later, as a container to protect integrated circuits (ICs) and to make them function, CerDIP was developed in 1967 followed by multilayer package in 1969. The tape layering technology used here is also applied in the manufacture of laminated ceramic capacitors and ceramic heaters.
In 1985, Kyocera developed amorphous silicon photoreceptor drum for use in copiers and printers. In the development process of solar modules, which has been researched since 1975, Kyocera researched amorphous silicon and amorphous silicon photoreceptor drum is the application of photoreceptor drum built into the heart of page printers. Since the life of a drum is extremely long, there is no need to replace the drum as with ordinary printers and Kyocera's printers are used throughout the world as environmentally friendly printers with extremely low running costs.
With deregulation of sales in mobile phone terminals in 1994, the market for mobile communications such as mobile phones and PHS expanded remarkably. This has brought a rapid shift to miniaturization of electronic components and surface mounting. Further advances have been made with high-density wiring and packaging technologies of ceramic circuit substrates and compact electronic components including voltage-controlled oscillators (VCO), which correspond to the heart of apparatus, thremo-compensating oscillators, dielectric filters and SAW filters.
Demand for ceramic parts for automobiles increased as automobiles evolved to be more electronically controlled. In addition to traditional engine parts such as glow plugs and heaters, usage of ceramic parts extended to substrates and packages used for Electronic Control Unit (ECU), electronic parts such as capacitors, and power-module substrates for electronic motors. The photograph shows an ECU module which consists of a ceramic substrate loaded with various electronic parts.
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