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Digital Showcase: Automotive > Product Overview > Devices > Component Assembly Technology for Ceramic ECUs    Japanese

Component Assembly Technology for Ceramic ECUs

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Component Assembly Technology for Ceramic ECUs
Ceramic electronic control unit (ECU) modules depend on high-density component assembly technologies. Kyocera, the world leader in ceramic multilayer substrates, provides state-of-the-art assembly services using the industry's most advanced resources and technologies.

 Product Outline
Features
· Reliability design technologies
· Surface mounting technologies
· Bare-chip mounting technologies

Applications
· ECUs for fuel injection
· ECUs for automatic transmissions
· ECUs for electronic power steering
· ECUs for starters / alternators
· DC-DC converters

 Ceramic ECU Assembly Technologies
1. Reliability design technologies
  (1) Simulation technologies
    Mechanical strength, life time, vibration, heat dissipation, circuit, radio frequencies
  (2) For automotive environment
    Heat durability, moisture resistance, vibration resistance, EMC
     
2. Surface mounting technologies
  (1) Adopt Pb-free solder (Sn-Ag-Cu system)
  (2) Design technologies for high reliability assembly
    Optimum pad design, optimum solder volume
  (3) Sealing
    ·Epoxy seal for gold wire, Silicone gel glob top for Al wire
    ·Underfill by epoxy resin, etc.
     
3. Bare-chip mounting technologies
  (1) Bare-chip mounting without heat spreader
    Solder pre-form, silver-filled epoxy paste
  (2) Wire bonding
    Au wire: 20 micron to 50 micron dia. in heating condition
    Al wire: 20 micron to 500 micron dia, in room temperature
  (3) Flip-chip solder bumping

 Evaluation Results of Pb-free Solder
Cumulative Break Probability vs. Thermal Cycles   Fatigue Fracture of Solder Materials

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 Related Information
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Multilayer Ceramic Substrates for ECUs
 
 
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