| 1. |
Reliability design technologies |
| |
(1) |
Simulation technologies |
| |
|
Mechanical strength, life time, vibration, heat dissipation, circuit, radio frequencies |
| |
(2) |
For automotive environment |
| |
|
Heat durability, moisture resistance, vibration resistance, EMC |
| |
|
|
| 2. |
Surface mounting technologies |
| |
(1) |
Adopt Pb-free solder (Sn-Ag-Cu system) |
| |
(2) |
Design technologies for high reliability assembly |
| |
|
Optimum pad design, optimum solder volume |
| |
(3) |
Sealing |
| |
|
·Epoxy seal for gold wire, Silicone gel glob top for Al wire |
| |
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·Underfill by epoxy resin, etc. |
| |
|
|
| 3. |
Bare-chip mounting technologies |
| |
(1) |
Bare-chip mounting without heat spreader |
| |
|
Solder pre-form, silver-filled epoxy paste |
| |
(2) |
Wire bonding |
| |
|
Au wire: 20 micron to 50 micron dia. in heating condition |
| |
|
Al wire: 20 micron to 500 micron dia, in room temperature |
| |
(3) |
Flip-chip solder bumping |
Japanese
