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| Kyocera offers various types of lids for ceramic package sealing. Ceramic, glass, and metal lids are available with low-temperature sealing glass, solder, and pre-coated epoxy resins as standard sealing materials. Lids with an RF absorber are also available, helping to "absorb" radiation noise from IC's and/or cavity resonance. |
| Product Outline |
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 Image Sensor Lid |
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With B-Stage epoxy coating |
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Tight dust control |
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Various optical glass options |
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| Surface Mount Device (SMD) Lid |
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Various sealing options |
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Various open tools |
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| MEMS Lid |
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Various sealing options |
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Various open tools |
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| IC Package Lid |
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Various sealing options |
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| RF Absorber Lid |
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Noise Reduction at High Frequency |
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Reduction of Cavity Resonance Noise |
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Hermetic Sealing Available |
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| Product Characteristics |
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| Transmission line for evaluation |
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Characteristics of RF absorber |
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Measured by putting RF absorber on alumina ceramic (Al2O3) with micro-strip line
(Sample : 8.4mmSQ×t 1.0mm) |
| Measurement Result |
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Metal Lid Without RF Absorber
Cavity Resonance Phenomenon At 20G to 70GHz |
Metal With RF Absorber (t 0.5mm) |
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Japanese
