Kyocera ECU substrates provide high density circuit design, high temperature durability, good heat dissipation and high reliability with multilayer ceramics. HTCC (High Temperature Co-fired Ceramics, alumina system), and LTCC (Low Temperature Co-fired Ceramics, glass ceramic system) are available. Printed resistors and high-current-capacity "Trough" conductive line structures are also available.
Product Outline
Features
·
100 micron via, line width and pattern gap possible for high density design
·
High temperature durability suitable for "In-Transmission" harsh environments
·
Ceramic’s high thermal conductivity provides excellent heat dissipation
·
Thermal expansion matching allows high reliability in bare-chip assembly to the board
·
Available with printed resistors on the back side of the substrate
·
High-current-capacity "Trough" conductive line structures are available
Applications
·
ECUs for fuel injection
·
ECUs for automatic transmissions
·
ECUs for electronic power steering
·
ECUs for starters/alternators
·
DC-DC converters
Typical Structure of Alumina Multi-layer Substrate
Product Characteristics
Example of Reliability Test Results
Alumina multi-layer substrate (tested as substrate only)
Japanese
